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CERAMIC 封装
CERAMIC 封装形式脚位封装技术介绍。
封装分类
AGP
AMR
AX14
AX078
BGA
C-Bend Lead
CERAMIC
CERPACK
CERQUAD
CLCC
CNR
DIE
DIMM
DIP
DO-4
DO-5
DO-8
DO-9
EISA
FBGA
Flat Pack
FTO
Gull Wing Leads
HR-16
HR-23
HSOP
HT16
HT23
HT29
ISA
ISOLATED
ITO
JLCC
LAMINATE
LCC
LCCC
LDCC
LGA
LLP
LQFP
MDIP
METAL QUAD 101L
MICRO ARRAY
MICRO SMD
MICRO SMDXT
MINI SOIC
PCI
PCMCIA
PGA
PLCC
POS
PQFP
PSDIP
PSOP
QFN
QFP
QGP
RIMM
SBGA
SC-70
SC-71
SIMM
SIP
SLOT
SNAPTK
SNAPZP
SO
SOCKET
SOH
SOIC
SOJ
SOP
SOT-220
SOT-89
SOT
SOT-223
SOT-23
SSOP
TEPBGA
TO-252
TO-263
TO-268
TO-100
TO-126
TO-127
TO-18
TO-202
TO-218
TO-220
TO-247
TO-264
TO-3
TO-46
TO-48
TO-5
TO-52
TO-55
TO-65
TO-71
TO-72
TO-78
TO-8
TO-83
TO-92
TO-93
TO-94
TO-99
TQFP
TSOP
TSSOP
TVSOP
VL Bus
WAFER
XT Bus
ZIP
CERAMIC封装形式
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