专业电子元器件、半导体封装工艺技术网
半导体封装网-提供芯片、IC、贴片电解电容、二极管三极管、晶振、模块的BGA封装、TO封装、芯片封装、SMD封装、DIP SOP QFP PGA CSP SIP SO TOP PLCC PQFP SDIP SOIC SSOP CDIP CLCC CQFP LQFP MAPBGA PBGA等各种类型的封装脚位图及技术工艺资料。
封装分类
- LAMINATE CSP 16
- LAMINATE CSP 24
- LAMINATE CSP 28
- LAMINATE CSP 48
- LAMINATE TCSP 20
- LAMINATE TCSP 32
- LAMINATE UCSP 20
- LAMINATE UCSP 24
- LAMINATE UCSP 32
- LLP 12
- LLP 14
- LLP 16
- LLP 20
- LLP 24
- LLP 28
- LLP 32
- LLP 36
- LLP 40
- LLP 44
- LLP 48
- LLP 54
- LLP 56
- LLP 6
- LLP 60
- LLP 64
- LLP 68
- LLP 8
- LLP COL
- MICRO SMD 10
- MICRO SMD 14
- MICRO SMD 16
- MICRO SMD 25
- MICRO SMD 30
- MICRO SMD 42
- MICRO SMD 5
- MICRO SMD 6
- MICRO SMD 8
- SOIC NARROW 14
- SOIC NARROW 16
- SOIC NARROW 8
- SOIC WIDE 14
- SOIC WIDE 16
- SOIC WIDE 20
- SOIC WIDE 24
- SOIC WIDE 28
- TSSOP 14
- TSSOP 16
- TSSOP 20
- TSSOP 24
- TSSOP 28
- TSSOP 48
- TSSOP 56
- TSSOP EXP PAD 10
- TSSOP EXP PAD 14
- TSSOP EXP PAD 16
- TSSOP EXP PAD 20
- TSSOP EXP PAD 28
- TSSOP EXP PAD 64
封装脚位图
