TSSOP EXP PAD 14封装,TSSOP-EXP-PAD-14封装形式-TSSOP Package-ICpackage.org
半导体封装网
联系我们
网站地图
TSSOP TSSOP EXP PAD 14封装
TSSOP TSSOP EXP PAD 14封装形式脚位封装技术介绍。
封装分类
AGP
AMR
AX14
AX078
BGA
C-Bend Lead
CERAMIC
CERPACK
CERQUAD
CLCC
CNR
DIE
DIMM
DIP
DO-4
DO-5
DO-8
DO-9
EISA
FBGA
Flat Pack
FTO
Gull Wing Leads
HR-16
HR-23
HSOP
HT16
HT23
HT29
ISA
ISOLATED
ITO
JLCC
LAMINATE
LCC
LCCC
LDCC
LGA
LLP
LQFP
MDIP
METAL QUAD 101L
MICRO ARRAY
MICRO SMD
MICRO SMDXT
MINI SOIC
PCI
PCMCIA
PGA
PLCC
POS
PQFP
PSDIP
PSOP
QFN
QFP
QGP
RIMM
SBGA
SC-70
SC-71
SIMM
SIP
SLOT
SNAPTK
SNAPZP
SO
SOCKET
SOH
SOIC
SOJ
SOP
SOT-220
SOT-89
SOT
SOT-223
SOT-23
SSOP
TEPBGA
TO-252
TO-263
TO-268
TO-100
TO-126
TO-127
TO-18
TO-202
TO-218
TO-220
TO-247
TO-264
TO-3
TO-46
TO-48
TO-5
TO-52
TO-55
TO-65
TO-71
TO-72
TO-78
TO-8
TO-83
TO-92
TO-93
TO-94
TO-99
TQFP
TSOP
TSSOP
TVSOP
VL Bus
WAFER
XT Bus
ZIP
TSSOP封装形式
TSSOP 14封装
TSSOP 16封装
TSSOP 20封装
TSSOP 24封装
TSSOP 28封装
TSSOP 48封装
TSSOP 56封装
TSSOP EXP PAD 10封装
TSSOP EXP PAD 14封装
TSSOP EXP PAD 16封装
TSSOP EXP PAD 20封装
TSSOP EXP PAD 28封装
TSSOP EXP PAD 64封装
* Name
:
Website URL
:
* Comment
:
